Winbond

Winbond Electronics Corporation
華邦電子公司
Company type	Corporation
Industry	Semiconductors
Founded	1987; 37 years ago
Headquarters	Taichung, Taiwan
Key people	Arthur Yu-Cheng Chiao; (Chairman & CEO); Tung-Yi Chan; (President)
Products	Mobile DRAM; Specialty DRAM; Flash memory;
Website	www.winbond.com

Winbond Electronics Corporation (Chinese: 華邦電子公司; pinyin: Huábāng Diànzǐ Gōngsī) is a Taiwan-based corporation founded in 1987. It produces semiconductors and several types of integrated circuits (ICs) including dynamic random-access memory, static random-access memory, serial flash, microcontrollers, and Super I/O chips.

Winbond is the largest brand-name IC supplier in Taiwan and one of the biggest suppliers of semiconductors worldwide.^{[citation needed]}

History

Winbond was established in 1987 in Hsinchu Science Park in Taiwan.^[1]^[2] Its founder came from the Industrial Technology Research Institute.^[3] From 1987 to 1988 J.J Pan and Partners designed and constructed a fabrication plant known as IC Wafer Fab I Plant. This facility would produce 6 inch wafers. It was designed and constructed in 14 months. Later in 1989 to 1992, J.J Pan and Partners built a second fab for Winbond called IC Wafer Fab II Plant.^[4]

In 1992 Winbond joined the Precision RISC Organization and licensed HP's PA-RISC architecture to design and manufacture chips for X terminals and printers.^[5]

Winbond acquired affiliated chipset maker Symphony Laboratories, of San Jose, California, in October 1995.^[6]

Winbond was affected by power cuts caused by the 1999 Jiji earthquake forcing the company to pause manufacturing.^[7] By 2002 Winbond had 4,000 employees.^[1] In 2004 Winbond was said to have a "continuous-learning culture", having 1,200 training programs for its employees.^[8] In August 2004, Infineon announced a deal with Winbond to build a factory to make DRAM.^[9]

The computer IC, consumer electronics IC, and logic product foundry divisions of Winbond were spun off as Nuvoton Technology Corporation on 1 July 2008.^{[citation needed]}

In 2010 Winbond was manufacturing DDR2 DRAM using technology licensed from Qimonda.^[10]

In 2019 Karamba Security partnered with Winbond to make secure embedded flash products.^[11] In 2023 Winbond joined the Universal Chiplet Interconnect Express Consortium.^[12]